UV laser cutting drilling machine
Equipment Introduction:
lInternational first-class quality UV laser cutting drilling machine, within reach! The material has a high absorption rate for 355nm ultraviolet light, therefore ultraviolet lasers have a wider range of material adaptability;
lUsing semiconductor UV laser with high beam quality, high peak power, and narrow pulse width for "cold" processing, with a small heat affected zone and high cutting quality;
lOptimized optical focusing system, more suitable for ultra-fine cutting and drilling of various materials;
lA precision linear worktable and a fully closed-loop CNC system are used, and a granite tabletop is used to reduce the inertial vibration generated by motion, ensuring high precision at the micrometer level while maintaining fast cutting;
lCCD visual intelligent automatic positioning, professional image acquisition card and optical camera system, automatic positioning correction, focus capture, fast and accurate;
lA dedicated high negative pressure dust filtration system is used to ensure the removal of cutting dust, prevent splashing and pollution, and employ a vacuum adsorption platform to ensure the stability and flatness of the product;
lProfessional research and development of control software, user-friendly interface, powerful functions, easy operation, suitable for almost all design file formats and arbitrary shapes in the current processing field;
lEquipped with safety protective covers that meet export standards and have passed CE certification, to avoid personal injury caused by equipment operators' misoperation and minimize safety risks.
Application areas:
The Furun UV laser cutting drilling machine is used for fine drilling, cutting, and microfabrication of special materials. Mainly used for various materials such as glass, LCD screens, thin ceramics, semiconductor silicon wafers, IC grains, sapphire, polymer films, etc., including flexible circuit boards (such as CCM modules), RF soft hard bonding boards (such as PCB boards after mounting), ceramic soft film sheets, organic films, pressure-sensitive adhesive sheets (PSA), acrylic sheets, CCL thin copper foils, CVL cover films, PET/PI reinforcement sheets, FR-4 polymers, silicon and metal oxide functional films, hard and brittle materials, etc.
Technical parameters:
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